写真素材 - Digital integrated circuits various purposes in plastic and ceramic dual in-line packages with pins for thru-holes mounting laid in a row on a gray surface, close-up in selective focus
作品情報
Digital integrated circuits various purposes in plastic and ceramic dual in-line packages with pins for thru-holes mounting laid in a row on a gray surface, close-up in selective focus
- ID：234093323
- 作品種別：写真
- 作者名：anmbph
キーワード
- background
- case
- ceramic
- chip
- chip package
- chip pin
- component
- computer chip
- cpu
- digital
- dip package
- dual in-line package
- electronic component
- electronic device
- electronic equipment
- electronics
- enhanced functionality
- eprom
- gray
- ic
- industry
- integrated circuit
- led indicator
- microchip
- microcircuit
- microcontroller
- miniaturization
- package house
- plastic
- printed circuit board
- rectangular
- row
- semiconducting material
- semiconductor
- semiconductor device
- silicon chip
- through-hole technology
- thru-hole mounting
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