素材 - Generative AI Semiconductor Wafer after Dicing Process. Silicon Dies are Being Extracted by Pick and Place Machine. Computer Chip Manufacturing. Packaging Process.
作品情報
Generative AI Semiconductor Wafer after Dicing Process. Silicon Dies are Being Extracted by Pick and Place Machine. Computer Chip Manufacturing. Packaging Process.
- ID：206262323
- 作品種別：
- 作者名：loft39studio
キーワード
- Advanced
- Arm
- Chip
- Chipmaker
- Circuit
- Cleanroom
- Component
- Computer
- Controller
- Cpu
- Development
- Device
- Die
- Disc
- Electronics
- Equipment
- Fab
- Fabrication
- Facility
- Factory
- Foundry
- Gpu
- Industrial
- Industry
- Integrated
- Line
- Lithography
- Machine
- Make
- Manufacturing
- Memory
- Microchip
- Microcontroller
- Nanotechnology
- Package
- Packaging
- Photolithography
- Pick and place
- Process
- Processor
- Production
- Research
- Robotics
- Science
- Semiconductor
- Shortage
- Silicon
- Technology
- Transistor
- Wafer
- ai
- generative ai
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